Contour measurement of UV pasting machine
By using linear blue laser, the ultra-high speed UV pasting machine profile measuring instrument "lj-x8000 series" avoids the influence caused by the material, luster and surface state of the target, and can measure the 2D section shape at high speed. Through image processing of 2D section data, 3D shape can be generated and more subtle coating defects can be detected.
In the packaging process of applying adhesive to the edge of CMOS packaging and bonding glass, once the height, position and volume (coating amount) of adhesive are poor, the air tightness of packaging will be reduced and the performance and deterioration resistance of products will be affected.
The 3D image processing shape detection using ultra-high speed profilometer "lj-x8000 series" and "vision system" can not only detect the width of adhesive and coating interruption, but also correctly detect the coating height which is difficult to be realized by image sensor. It can also carry out 64000 times / s ultra-high speed sampling, which is suitable for online detection with short production time of single product.
Before the emergence of 3D detection method, in the detection of printed circuit board pad (PAD) automatically coated with solder paste before reflow process, it is necessary to identify the coating area through image sensor.
"Lj-x8000 series" can not only identify the area of coated UV pasting machine solder paste, but also measure the height, volume and position at high speed. Even if the components are configured with high-density printed circuit boards, high-precision coating detection can be carried out.
